Bundle Communication Pipe Extrusion Line

Bundle communication pipe extrusion line is a specialized manufacturing system used to produce bundled microducts or multi-ducts for communication cables, particularly fiber optic cables. These bundle pipe extrusion line create a protective sheathing around multiple smaller individual conduits (microducts), allowing for organized and efficient installation of communication infrastructure.

What are Bundle Communication Pipes (Bundled Microducts)?

Instead of laying individual pipes for each fiber optic cable, bundled microducts combine several smaller, typically HDPE (High-Density Polyethylene) or silicon-cored microducts into a single, larger outer sheath. Bundle communication pipes provides a robust outer layer to shield the delicate microducts from physical damage and environmental factors. Simplifies the blowing or pulling of fiber optic cables through the pre-installed microducts.

Bundle Communication Pipe Extrusion Line Process:

1. Raw Material Feeding: HDPE or silicon-cored HDPE granules are fed into a single-screw extruder.

2. Melting and Plasticizing: The extruder heats and melts the plastic, creating a homogeneous melt.

3. Die Head: The molten plastic is forced through a specialized die head to form the desired diameter and shape of the individual microducts. Silicone is often co-extruded as an inner layer to reduce friction for cable blowing.

4. Vacuum Sizing and Cooling: The hot microducts pass through a vacuum calibration tank and cooling tanks (usually stainless steel water baths) to precisely set their dimensions and solidify them.

5. Haul-off: A haul-off unit (e.g., caterpillar type) pulls the microducts consistently through the bundle pipe production line.

6. Coiling: The finished individual microducts are wound onto reels.

The bundle pipe production line is critical for the expansion of telecommunication networks, particularly with the global rollout of fiber optic broadband. They emphasize high precision, efficiency, and the ability to produce a wide range of bundle configurations.